BS-EN-60749 › Semiconductor devices. Mechanical and climatic test methods
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Keywords
Integrated circuits;Solderability testing;Strength of materials;Dimensional measurement;Classification systems;Specimen preparation;Accelerated testing;Pull-out tests;Mass spectrometry;Mechanical testing;Thermal-shock tests;Storage;Electrical testing;Visual inspection (testing);Torsion testing;Low-pressure tests;Defects;Endurance testing;Test equipment;Test specimens;Electric terminals;Temperature measurement;Environmental testing;Marking;Shear testing;Leak tests;Electronic equipment and components;Bonding;Stress;Moisture measurement;Vibration testing;Radioactive tracer methods;Thermal testing;Semiconductor devices;Fire tests;Damp-heat tests;Flammability;Testing conditions
To find similar documents by classification:
31.080.01 (Semiconductor devices in general)
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Document Number
BS EN 60749:1999
Revision Level
1999 EDITION
Status
Superseded
Publication Date
Sept. 23, 2002
Replaces
BS 6493-3:1985
Replaced By
BS EN 60749-1:2003;BS EN 60749-8:2003;BS EN 60749-5:2003;BS EN 60749-32:2003+A1:2010;BS EN 60749-31:2003;BS EN 60749-22:2003;BS EN 60749-20:2003;BS EN 60335-2-11:2001
Replaced by Notes
BS EN 60749-14:2003;BS EN 60749-21:2005;BS EN 60749-9:2002;BS EN 60749-26:2006;BS EN 60749-10:2002;BS EN 60749-13:2002;BS EN 60749-27:2006+A1:2012;BS EN 60749-2:2002;BS EN 60749-15:2003;BS EN 60749-3:2002;BS EN 60749-12:2002;BS EN 60749-11:2002;BS EN 60749-7:2002;BS EN 60749-5:2003;BS EN 60749-6:2002;BS EN 60749-39:2006;BS EN 60749-25:2003;BS EN 60749-19:2003+A1:2010;BS EN 60749-36:2003;BS EN 60749-4:2002
Page Count
80
ISBN
0580321517
International Equivalent
EN 60749/A2 (IEC 60749/A2:2001 AS);IEC 60749:1996/AMD2:2001
Committee Number
EPL/47