Document Center List of Standards on Semiconductor Devices Semiconducting Materials, See 29.045
ICS Code 31.080
Return to ICS Index.Up to Level 1:
Down to Level 3:
- 31.080.01 (Semiconductor devices in general)
- 31.080.10 (Diodes)
- 31.080.20 (Thyristors)
- 31.080.30 (Transistors)
- 31.080.99 (Other semiconductor devices)
The following documents are a part of this series:
BSI:
- BS-EN-60749-34 - Semiconductor devices. Mechanical and climatic test methods
- BS-EN-IEC-60747-16-6 - Semiconductor devices
- BS-IEC-60747-19-1 - Semiconductor devices
- BS-IEC-62951-8 - Semiconductor devices. Flexible and stretchable semiconductor devices
- BS-IEC-63229 - Semiconductor devices. Classification of defects in gallium nitride epitaxial film on silicon carbide substrate
IEC:
- IEC-134 - Rating systems for electronic tubes and valves and analogous semiconductor devices
- IEC-60050-521 - International Electrotechnical Vocabulary - Part 521: Semiconductor devices and integrated circuits
- IEC-60191-4 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
- IEC-60191-4-2 - Amendment 2, Mechanical Standardization of Semiconductor Devices Part 4: Coding System and C
- IEC-60191-5 - Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
- IEC-60747-1 - Semiconductor devices - Part 1: General
- IEC-60747-1-1 - Amendment 1 - Semiconductor devices - Part 1: General
- IEC-60748-22-1 - Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
- IEC-60748-5 - Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
- IEC-60749-24 - Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
- IEC-60749-33 - Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
- IEC-60828 - Pin Allocations for Microprocessor Systems Using the IEC-603-2 Connector
- IEC-62373 - Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET)
- IEC-62374 - Semiconductor devices - Time dependent dielectric breakdown (TDDB) test for gate dielectric films
- IEC-62374-1 - Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
- IEC-62415 - Semiconductor devices - Constant current electromigration test
- IEC-62416 - Semiconductor devices - Hot carrier test on MOS transistors
- IEC-62417 - Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
- IEC-62418 - Semiconductor devices - Metallization stress void test
- IEC-62615 - Electrostatic Discharge Sensitivity Testing - Transmission Line Pulse (Tlp) - Componen
- IEC-828 - Pin Allocations for Microprocessor Systems Using the IEC-603-2 Connector
- IEC/PAS-62240 - Use of Semiconductor Devices Outside Manufacturer's Specified Temperature Ranges