IEC-62374-1 › Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

IEC-62374-1 - EDITION 1.0 - CURRENT


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IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
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31.080 (Semiconductor devices Semiconducting materials, see 29.045)

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Document Number

IEC 62374-1 Ed. 1.0 b:2010

Revision Level

EDITION 1.0

Status

Current

Publication Date

Sept. 1, 2010

Committee Number

47