IEC-62418 › Semiconductor devices - Metallization stress void test

IEC-62418 - EDITION 1.0 - CURRENT


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IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.
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31.080 (Semiconductor devices Semiconducting materials, see 29.045)

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Document Number

IEC 62418 Ed. 1.0 b:2010

Revision Level

EDITION 1.0

Status

Current

Publication Date

April 1, 2010

Committee Number

47