Document Center List of Standards on Electronic Components In General Magnetic Components, See 29.100.10
ICS Code 31.020
Return to ICS Index.Up to Level 1:
The following documents are a part of this series:
ASTM:
- ASTM-E1250 - Standard Test Method for Application of Ionization Chambers to Assess the Low Energy Gamma Component of Cobalt-60 Irradiators Used in Radiation-Hardness Testing of Silicon Electronic Devices
- ASTM-E1854 - Standard Practice for Ensuring Test Consistency in Neutron-Induced Displacement Damage of Electronic Parts
- ASTM-E668 - Standard Practice for Application of Thermoluminescence-Dosimetry (TLD) Systems for Determining Absorbed Dose in Radiation-Hardness Testing of Electronic Devices
- ASTM-F1190 - Standard Guide for Neutron Irradiation of Unbiased Electronic Components
- ASTM-F1263 - Standard Guide for Analysis of Overtest Data in Radiation Testing of Electronic Parts
- ASTM-F1467 - Standard Guide for Use of an X-Ray Tester (≈10 keV Photons) in Ionizing Radiation Effects Testing of Semiconductor Devices and Microcircuits
- ASTM-F3147 - Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend (Withdrawn 2024)
- ASTM-F59 - Method for Identification of Metal Particulate Contamination Found in Electronic and Microelectronic Components and Systems Using the Ring Oven Technique, With Spot Tests (Withdrawn 1994)
- ASTM-F60 - Methods for Detection and Enumeration of Microbiological Contaminants in Water Used for Processing Electron and Microelectronic Devices (Withdrawn 1991)
- ASTM-F677 - Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications (Withdrawn 2013)
- ASTM-F71 - Standard Practice for Using the Morphological Key for the Rapid Identification of Fibers for Contamination Control in Electron Devices and Microelectronics (Withdrawn 2005)
BSI:
- BIP-2117 - The Waste Electrical and Electronic Equipment Directive. Requirements and implementation
- BS-5692 - Method for measurement of the dimensions of a cylindrical electronic component having two axial terminations
- BS-6062-3 - Packaging of electronic components for automatic handling
- BS-6103 - Specification for dimensions for the mounting of single-hole, bush-mounted spindle operated electronic components
- BS-6943 - Classification of shapes of electronic components for placement on printed wiring boards
- BS-7594 - Code of practice for audio-frequency induction-loop systems (AFILS)
- BS-9000-1 - General requirements for a system for electronic components of assessed quality
- BS-9000-2 - General Requirements for a System for Electronic Components of Assessed Quality, Spec
- BS-9000-3 - General requirements for a system for electronic components of assessed quality
- BS-9000-4 - General requirements for a system for electronic components of assessed quality
- BS-9000-5 - General requirements for a system for electronic components of assessed quality
- BS-9000-6 - General requirements for a system for electronic components of assessed quality
- BS-9000-7 - General requirements for a system for electronic components of assessed quality
- BS-9005 - Specification for general procedures to be followed for the capability approval of electronic components covered by BS 9000:Part 1
- BS-CECC-00009 - Harmonized system of quality assessment for electronic components. Basic specification: basic testing procedures and measuring methods for electromechanical components
- BS-CECC-00803 - Harmonized System of Quality Assessment for Electronic Components. Guidance Document:V
- BS-EN-100012 - Harmonized system of quality assessment for electronic components. Basic specification. X-ray inspection of electronic components
- BS-EN-100015-1 - Basic specification. Protection of electrostatic sensitive devices. Harmonized system of quality assessment for electronic components. Basic specification: protection of electrostatic sensitive devices. General requirements
- BS-EN-100015-2 - Basic specification. Protection of electrostatic sensitive devices. Requirements for low humidity conditions
- BS-EN-100015-3 - Basic specification. Protection of electrostatic sensitive devices. Requirements for clean room areas
- BS-EN-100015-4 - Basic specification. Protection of electrostatic sensitive devices. Requirements for high voltage environments
- BS-EN-100114 - Rule of Procedure 14. Quality assessment procedures
- BS-EN-100114-1 - CECC Quality assessment procedure for electronic components
- BS-EN-100114-1/ISS 2 - Rule of Procedure 14. Quality assessment procedures. Approval of manufacturers and other organizations
- BS-EN-100114-6 - CECC Quality assessment procedure for electronic components. Technology approval of electronic component manufacturers
- BS-EN-45556 - General method for assessing the proportion of reused components in energy-related products
- BS-EN-50419 - Marking of electrical and electronic equipment (EEE) in respect to separate collection of waste EEE (WEEE)
- BS-EN-50581 - Technical documentation for the assessment of electrical and electronic products with respect to the restriction of hazardous substances
- BS-EN-60062 - Marking codes for resistors and capacitors
- BS-EN-60068-2-54 - Environmental testing
- BS-EN-60204-1 - Safety of machinery. Electrical equipment of machines
- BS-EN-60286-1 - Packaging of components for automatic handling
- BS-EN-60286-2 - Packaging of components for automatic handling
- BS-EN-60286-2-TC - Tracked Changes. Packaging of components for automatic handling
- BS-EN-60286-3 - Packaging of components for automatic handling. Packaging of surface mount components on continuous tapes
- BS-EN-60286-3-1 - Packaging of components for automatic handling
- BS-EN-60286-3-2 - Packaging of components for automatic handling
- BS-EN-60286-4 - Packaging of components for automatic handling
- BS-EN-60286-5 - Packaging of components for automatic handling. Matrix trays
- BS-EN-60294 - Measurement of the dimensions of a cylindrical component with axial terminations
- BS-EN-60617-10 - Graphical symbols for diagrams
- BS-EN-60617-11 - Architectural and Topographical Installation Plans and Diagrams
- BS-EN-60617-13 - Graphical symbols for diagrams. Analogue elements
- BS-EN-60617-2 - Symbol Elements, Qualifying Symbols and Other Symbols Havinggeneral Application
- BS-EN-60617-3 - Graphical symbols for diagrams. Conductors and connecting devices
- BS-EN-61340-5-1 - Electrostatics
- BS-EN-61360-1 - Standard data element types with associated classification scheme
- BS-EN-61360-1-TC - Tracked Changes. Standard data element types with associated classification scheme
- BS-EN-61360-2 - Standard data element types with associated classification scheme for electric components
- BS-EN-61360-4 - Standard data element types with associated classification scheme for electric components
- BS-EN-61360-6 - Standard data element types with associated classification scheme for electric components
- BS-EN-61709 - Electric components. Reliability. Reference conditions for failure rates and stress models for conversion
- BS-EN-61709-TC - Tracked Changes. Electric components. Reliability. Reference conditions for failure rates and stress models for conversion
- BS-EN-61760-1 - Surface mounting technology
- BS-EN-61760-2 - Surface mounting technology
- BS-EN-62321 - Electrotechnical products. Determination of levels of six regulated substances (lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls, polybrominated diphenyl ethers)
- BS-EN-62321-2 - Determination of certain substances in electrotechnical products
- BS-EN-62321-3-1 - Determination of certain substances in electrotechnical products
- BS-EN-62321-3-2 - Determination of certain substances in electrotechnical products
- BS-EN-62321-4 - Determination of certain substances in electrotechnical products
- BS-EN-62321-5 - Determination of certain substances in electrotechnical products
- BS-EN-62321-7-2 - Determination of certain substances in electrotechnical products
- BS-EN-62321-8 - Determination of certain substances in electrotechnical products
- BS-EN-62430 - Environmentally conscious design for electrical and electronic products
- BS-EN-62435-1 - Electronic components. Long-term storage of electronic semiconductor devices
- BS-EN-62435-2 - Electronic components. Long-term storage of electronic semiconductor devices
- BS-EN-62435-5 - Electronic components. Long-term storage of electronic semiconductor devices
- BS-EN-62474 - Material declaration for products of and for the electrotechnical industry
- BS-EN-63002 - Identification and communication interoperability method for external power supplies used with portable computing devices
- BS-EN-954-1 - Safety of machinery. Safety related parts of control systems. General principles for design
- BS-EN-IEC-60286-2 - Packaging of components for automatic handling
- BS-EN-IEC-60286-2-TC - Tracked Changes. Packaging of components for automatic handling
- BS-EN-IEC-60286-3 - Packaging of components for automatic handling
- BS-EN-IEC-60286-5 - Packaging of components for automatic handling
- BS-EN-IEC-60938-1 - Fixed inductors for electromagnetic interference suppression
- BS-EN-IEC-60938-2-1 - Fixed inductors for electromagnetic interference suppression
- BS-EN-IEC-60938-2-1-TC - Tracked Changes. Fixed inductors for electromagnetic interference suppression
- BS-EN-IEC-61340-5-1-TC - Tracked Changes. Electrostatics
- BS-EN-IEC-61760-1 - Surface mounting technology
- BS-EN-IEC-61760-2 - Surface mounting technology
- BS-EN-IEC-61760-2-TC - Tracked Changes. Surface mounting technology
- BS-EN-IEC-62435-3 - Electronic components. Long-term storage of electronic semiconductor devices
- BS-EN-IEC-62435-4 - Electronic components. Long-term storage of electronic semiconductor devices
- BS-EN-IEC-62435-6 - Electronic components. Long-term storage of electronic semiconductor devices
- BS-EN-IEC-62435-7 - Electronic components. Long-term storage of electronic semiconductor devices
- BS-EN-IEC-62435-8 - Electronic components. Long-term storage of electronic semiconductor devices
- BS-EN-IEC-62435-9 - Electronic components. Long-term storage of electronic semiconductor devices
- BS-EN-IEC-62668-1 - Process management for avionics. Counterfeit prevention
- BS-EN-IEC-63000-TC - Tracked Changes. Technical documentation for the assessment of electrical and electronic products with respect to the restriction of hazardous substances
- BS-EN-IEC-63002 - Interoperability specifications and communication method for external power supplies used with computing and consumer electronics devices
- BS-EN-IEC-63203-402-1 - Wearable electronic devices and technologies
- BS-EN-IEC-63203-402-2 - Wearable electronic devices and technologies
- BS-EN-IEC-63203-406-1 - Wearable electronic devices and technologies
- BS-IEC-60286-2 - Packaging of components for automatic handling. Packaging of components with unidirectional leads on continuous tapes
- BS-IEC-60286-4 - Packaging of components for automatic handling. Stick magazines for electronic components encapsulated in packages of different forms
- BS-IEC-61360-7 - Standard data element types with associated classification scheme
- BS-IEC-62396-1 - Process management for avionics. Atmospheric radiation effects. Accommodation of atmospheric radiation effects via single event effects within avionics electronic equipment
- BS-IEC-62396-2 - Process management for avionics. Atmospheric radiation effects
- BS-IEC-62396-2-TC - Tracked Changes. Process management for avionics. Atmospheric radiation effects
- BS-IEC-62396-3 - Process management for avionics. Atmospheric radiation effects
- BS-IEC-62396-4 - Process management for avionics. Atmospheric radiation effects
- BS-IEC-62396-5 - Process management for avionics. Atmospheric radiation effects
- BS-IEC-63002 - Identification and communication interoperability method for external power supplies used with portable computing devices
- BS-ISO-17901-1 - Optics and photonics. Holography
- BS-ISO-17901-2 - Optics and photonics. Holography
- BS-QC-210000 - Technology approval schedules. Requirements under the IEC Quality Assessment System for Electronic Components (IECQ)
- DD-CLC-50466 - Long duration storage of electronic components. Specification for implementation
- DD-IEC-62239 - Process management for avionics. Preparation of an electronic components management plan
- DD-IEC-62396-2 - Process management for avionics. Atmospheric radiation effects. Guidelines for single event effects testing for avionics systems
- DD-IEC-62396-3 - Process Management for Avionics, Atmospheric Radiation Effects, Optimizing System Desi
- DD-IEC-62396-4 - Process Management for Avionics, Atmospheric Radiation Effects, Guidelines for Designi
- DD-IEC-62396-5 - Process management for avionics. Atmospheric radiation effects
- DD-IEC-62500 - Process management for avionics. Defining and performing highly accelerated tests in aerospace systems. Application guide
- DD-IEC-62564-1 - Process management for avionics. Aerospace qualified electronic components (AQEC)
- DD-IEC/PAS-61906 - Procedure for the declaration of materials in products of the electrotec hnical and electronics industry
- DD-IEC/PAS-62396-2 - Process management for avionics. Atmospheric radiation effects
- DD-IEC/PAS-62396-3 - Process Management for Avionics, Atmospheric Radiation Effects, Optimising System Desi
- DD-IEC/PAS-62396-4 - Process Management for Avionics, Atmospheric Radiation Effects, Guidelines for Designi
- DD-IEC/PAS-62396-5 - Process management for avionics. Atmospheric radiation effects. Guidelines for assessing thermal neutron fluxes and effects in avionics systems
- DD-IEC/PAS-62435 - Electronic components. Long duration storage of electronic components. Guidance for implementation
- DD-IEC/PAS-62500 - Process management for avionics. Guide for defining and performing highly accelerated tests in avionic systems
- DD-IEC/PAS-62545 - Environmental information on electrical and electronic equipment (EIEEE)
- DD-IEC/PAS-62596 - Electrotechnical products. Determination of restricted substances. Sampling procedure. Guidelines
- DD-IEC/PAS-62647-23 - Process management for avionics. Aerospace and defence electronic systems containing lead-free solder
- DD-IEC/PAS-62647-3 - Process management for avionics. Aerospace and defence electronic systems containing lead-free solder
- DD-IEC/PAS-62686-1 - Process management for avionics. Aerospace qualified electronic components (AQEC)
- HB-10193 - Newnes Electronic Engineer's Pocket Book
- PAS-8855 - Vaping products and vaping devices. Quality, safety and performance. Specification
- PD-6614 - Obsolescence management. Guide to the substitution of components in electronic equipment
- PD-6667 - Obsolescence management. Code of practice for obsolescence notification and support from suppliers of electronic components
- PD-CLC-50489 - Smart tracker chips. Feasibility study on the inclusion of RFID in electrical and electronic equipment for WEEE management
- PD-CLC-61340-5-2 - Electrostatics. Protection of electronic devices from electrostatic phenomena. User guide
- PD-IEC-60286-6-1 - Packaging of components for automatic handling
- PD-IEC-60286-7 - Packaging of components for automatic handling
- PD-IEC-61734 - Application of symbols for binary logic and analogue elements
- PD-IEC-62152 - Transmission properties of cascaded two-ports or quadripols. Background of terms and definitions
- PD-IEC-62239-1 - Process management for avionics. Management plan
- PD-IEC-62239-2 - Process management for avionics. Management plan
- PD-IEC-62240 - Process management for avionics. Use of semiconductor devices outside manufacturers' specified temperature range
- PD-IEC-62240-1 - Process management for avionics. Electronic components capability in operation
- PD-IEC-62240-1-TC - Tracked Changes. Process management for avionics. Electronic components capability in operation
- PD-IEC-62240-2 - Process management for avionics. Electronic components capability in operation
- PD-IEC-62396-6 - Process management for avionics. Atmospheric radiation effects
- PD-IEC-62396-7 - Process management for avionics. Atmospheric radiation effects
- PD-IEC-62396-8 - Process management for avionics. Atmospheric radiation effects
- PD-IEC-62474-1 - Material declaration for products of and for the electrotechnical industry
- PD-IEC-62476 - Guidance for evaluation of products with respect to substance-use restrictions in electrical and electronic products
- PD-IEC-62500-TC - Tracked Changes. Process management for avionics. Highly severe stress tests for operating margins identification and robustness improvement of avionics equipment. Application guidelines
- PD-IEC-62564-1 - Process management for avionics. Aerospace qualified electronic components (AQEC)
- PD-IEC-62564-1-TC - Tracked Changes. Process management for avionics. Aerospace qualified electronic components (AQEC)
- PD-IEC-62647-1 - Process management for avionics. Aerospace and defence electronic systems containing lead-free solder
- PD-IEC-62647-2 - Process management for avionics. Aerospace and defence electronic systems containing lead-free solder
- PD-IEC-62647-21 - Process management for avionics. Aerospace and defence electronic systems containing lead-free solder
- PD-IEC-62647-22 - Process management for avionics. Aerospace and defence electronic systems containing lead-free solder
- PD-IEC-62647-23 - Process management for avionics. Aerospace and defence electronic systems containing lead-free solder
- PD-IEC-62647-3 - Process management for avionics. Aerospace and defence electronic systems containing lead-free solder
- PD-IEC-62647-4 - Process management for avionics. Aerospace and defence electronic systems containing lead-free solder
- PD-IEC-62668-1 - Process management for avionics. Counterfeit prevention
- PD-IEC-62668-2 - Process management for avionics. Counterfeit prevention
- PD-IEC-62686-1 - Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications
- PD-IEC-62686-2 - Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications
- PD-IEC-63238-1 - Process management for avionics. Electronics design
- PD-IEC/PAS-62239 - Electronic component management plans
- PD-IEC/PAS-62396-6 - Process management for avionics. Atmospheric radiation effects
- PD-IEC/PAS-62647-1 - Process management for avionics. Aerospace and defence electronic systems containing lead-free solder
- PD-IEC/PAS-62686-2 - Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications
IEC:
- IEC-60050-114 - International Electrotechnical Vocabulary - Part 114: Electrochemistry
- IEC-60050-702-AM1 - Amendment 1 - International Electrotechnical Vocabulary - Chapter 702: Oscillations, signals and related devices
- IEC-60050-702-AM2 - Amendment 2 - International electrotechnical vocabulary - Part 702: Oscillations, signals and related devices
- IEC-60050-702-AM3 - Amendment 3 - International electrotechnical vocabulary - Part 702: Oscillations, signals and related devices
- IEC-60050-702-AM4 - Amendment 4 - International Electrotechnical Vocabulary (IEV) - Part 702: Oscillations, signals and related devices
- IEC-60050-702-AM5 - Amendment 5 - International Electrotechnical Vocabulary (IEV) - Part 702: Oscillations, signals and related devices
- IEC-60050-702-AM6 - Amendment 6 - International Electrotechnical Vocabulary (IEV) - Part 702: Oscillations, signals and related devices
- IEC-60062 - Marking codes for resistors and capacitors
- IEC-60062-AM1 - Amendment 1 - Marking codes for resistors and capacitors
- IEC-60068-2-54 - Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
- IEC-60286-1 - Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes
- IEC-60286-1-AM1 - Amendment 1 - Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes
- IEC-60286-2 - Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes
- IEC-60286-2-1 - Amendment 1: Packaging of Components for Automatic Handling- Part 2: Tape Packaging of C
- IEC-60286-3 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
- IEC-60286-3-2 - Packaging of components for automatic handling - Part 3-2: Packaging of surface mount components on continuous tapes - Type VI -lister carrier tapes of 4 mm width
- IEC-60286-3-3 - Packaging of components for automatic handling - Part 3-3: Packaging of surface mount components on continuous paper tapes for Auto Loading Feeder
- IEC-60286-3-4 - Packaging of components for automatic handling - Part 3-4: Packaging of surface mount components on continuous embossed tapes for Auto Loading Feeder
- IEC-60286-3-RL - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
- IEC-60286-4 - Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
- IEC-60286-5 - Packaging of components for automatic handling - Part 5: Matrix trays
- IEC-60286-5-1 - Amendment 1: Packaging of Components for Automatic Handling - Part 5: Matrix Trays
- IEC-60286-5-RL - Packaging of components for automatic handling - Part 5: Matrix trays
- IEC-60286-6 - Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
- IEC-60286-6-1 - Packaging of components for automatic handling - Part 6-1: Bulk case packaging for miniaturized surface mounting components
- IEC-60286-7 - Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components
- IEC-60294 - Measurement of the dimensions of a cylindrical component with axial terminations
- IEC-60300-3-7 - Part 3-7: Application Guide - Reliability Stress Screening Electronic Hardware, Dependabil
- IEC-60319 - Presentation and specification of reliability data for electronic components
- IEC-60938-1 - Fixed inductors for electromagnetic interference suppression - Part 1: Generic specification
- IEC-60938-1-1 - Amendment 1 - Fixed inductors for electromagnetic interference suppression - Part 1: Generic specification
- IEC-60938-2 - Fixed inductors for electromagnetic interference suppression - Part 2: Sectional specification on power line chokes
- IEC-60938-2-1 - Fixed inductors for electromagnetic interference suppression - Part 2-1: Blank detail specification - Inductors for which safety tests are required
- IEC-60938-2-2 - Fixed inductors for electromagnetic interference suppression - Part 2-2: Blank detail specification - Inductors for which safety tests are required (only)
- IEC-60938-2-AM 1 - Amendment 1 - Fixed inductors for electromagnetic interference suppression - Part 2: Sectional specification
- IEC-61163-2 - Reliability stress screening - Part 2: Components
- IEC-61360-1 - Standard data element types with associated classification scheme - Part 1: Definitions - Principles and methods
- IEC-61360-1-1 - Amendment 1: Standard Data Element Types With Associated Classification Scheme for Electri
- IEC-61360-2 - Standard data element types with associated classification scheme for electric components - Part 2: EXPRESS dictionary schema
- IEC-61360-2-1 - Amendment 1: Standard Data Element Types With Associated Classification Scheme for Electri
- IEC-61360-4 - Part 4: IEC Reference Collection of Standard Data Element Types & Component Classes, S
- IEC-61360-5 - Part 5: Extensions To the Express Dictionary Schema, Standard Data Element Types With Asso
- IEC-61360-6 - Standard data element types with associated classification scheme for electric components - Part 6: IEC Common Data Dictionary (IEC CDD) quality guidelines
- IEC-61360-7 - Standard data element types with associated classification scheme - Part 7: Data dictionary of cross-domain concepts
- IEC-61709 - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
- IEC-61709-RL - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
- IEC-62063 - High-voltage switchgear and controlgear - The use of electronic and associated technologies in auxiliary equipment of switchgear and controlgear
- IEC-62152 - Transmission properties of cascaded two-ports or quadripols - Background of terms and definitions
- IEC-62239 - Process management for avionics - Preparation of an electronic components management plan
- IEC-62239-1 - Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
- IEC-62239-2 - Process management for avionics - Management plan - Part 2: Preparation and maintenance of an electronic COTS assembly management plan
- IEC-62240 - Process Management for Avionics - Use of Semiconductor Devices Outside Manufacturer's
- IEC-62240-1 - Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
- IEC-62240-1-RL - Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
- IEC-62240-2 - Process management for avionics . Electronic components capability in operation . Part 2: Semiconductor microcircuit lifetime
- IEC-62321-7-2 - Determination of certain substances in electrotechnical products - Part 7-2: Hexavalent chromium - Determination of hexavalent chromium (Cr(VI)) in polymers and electronics by the colorimetric method
- IEC-62321-8 - Determination of certain substances in electrotechnical products - Part 8: Phthalates in polymers by gas chromatography-mass spectrometry (GC-MS), gas chromatography-mass spectrometry using a pyrolyzer/thermal desorption accessory (Py-TD-GC-MS)
- IEC-62396-1 - Process management for avionics - Atmospheric radiation effects - Part 1: Accommodation of atmospheric radiation effects via single event effects within avionics electronic equipment
- IEC-62396-1-RL - Process management for avionics - Atmospheric radiation effects - Part 1: Accommodation of atmospheric radiation effects via single event effects within avionics electronic equipment
- IEC-62396-2 - Process management for avionics - Atmospheric radiation effects - Part 2: Guidelines for single event effects testing for avionics systems
- IEC-62396-3 - Part 3: Optimising System Design To Accommodate the Single Event Effects (See) of Atmo
- IEC-62396-4 - Process management for avionics - Atmospheric radiation effects - Part 4: Design of high voltage aircraft electronics managing potential single event effects
- IEC-62396-5 - Process management for avionics - Atmospheric radiation effects - Part 5: Guidelines for assessing thermal neutron fluxes and effects in avionics systems
- IEC-62396-6 - Process management for avionics - Atmospheric radiation effects - Part 6: Extreme space weather - Potential impact on the avionics environment and electronics
- IEC-62396-7 - Process management for avionics - Atmospheric radiation effects - Part 7: Management of single event effects (SEE) analysis process in avionics design
- IEC-62435-1 - Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
- IEC-62435-2 - Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
- IEC-62435-3 - Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
- IEC-62435-4 - Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
- IEC-62435-5 - Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
- IEC-62435-6 - Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or finished devices
- IEC-62435-7 - Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
- IEC-62435-8 - Electronic components . Long-term storage of electronic semiconductor devices . Part 8: Passive electronic devices
- IEC-62435-9 - Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special cases
- IEC-62474 - Material declaration for products of and for the electrotechnical industry
- IEC-62474-1 - Material declaration for products of and for the electrotechnical industry - Part 1: Guidance on the implementation of IEC 62474
- IEC-62500 - Process management for avionics - Highly severe stress tests for operating margins identification and robustness improvement of avionics equipment - Application guidelines
- IEC-62564-1 - Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors
- IEC-62635 - Guidelines for end-of-life information provided by manufacturers and recyclers and for recyclability rate calculation of electrical and electronic equipment
- IEC-62647-1 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
- IEC-62647-2 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
- IEC-62647-21 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics
- IEC-62647-22 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
- IEC-62647-23 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
- IEC-62647-3 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
- IEC-62668-1 - Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components
- IEC-62668-1-AM1 - Amendment 1 - Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components
- IEC-62668-2 - Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources
- IEC-62686-1 - Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
- IEC-62686-2 - Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 2: General requirements for passive components
- IEC-62899-550-1 - Printed electronics - Part 550-1 : Quality assessment - Framework document on durability testing - Mechanical and thermal testing
- IEC-63000 - Technical documentation for the assessment of electrical and electronic products with respect to the restriction of hazardous substances
- IEC-63000-AM1 - Amendment 1 - Technical documentation for the assessment of electrical and electronic products with respect to the restriction of hazardous substances
- IEC-63002 - Interoperability specifications and communication method for external power supplies used with computing and consumer electronics devices
- IEC-63203-401-1 - Wearable electronic devices and technologies - Part 401-1: Devices and systems: functional elements - Evaluation method of the stretchable resistive strain sensor
- IEC-63203-402-1 - Wearable electronic devices and technologies - Part 402-1: Performance measurement of fitness wearables - Test methods of glove-type motion sensors for measuring finger movements
- IEC-63203-402-2 - Wearable electronic devices and technologies - Part 402-2: Performance measurement of fitness wearables - Step counting
- IEC-63203-402-3 - Wearable electronic devices and technologies - Part 402-3: Performance measurement of fitness wearables - Test methods for the determination of the accuracy of heart rate
- IEC-63238-1 - Process management for avionics - Electronics design - Part 1: Electrical signal properties, naming conventions and interface control document (ICD)
- IEC-GUIDE-102 - Electronic components - Specification structures for quality assessment (Qualification approval and capability approval)
- IEC/PAS-61906 - Procedure for the declaration of materials in products of the electrotechnical and electronic industry
- IEC/PAS-62396-2 - Part 2: Guidelines for Single Event Effects Testing for Avionics Systems, Process Mana
- IEC/PAS-62396-3 - Part 3: Optimising System Design To Accommodate the Single Event Effects (See) of Atmo
- IEC/PAS-62396-4 - Part 4: Guidelines for Designing With High Voltage Aircraft Electronics & Potential S
- IEC/PAS-62396-5 - Part 5: Guidance for Assessing Thermal Neutron Fluxes & Effects in Avionics Systems, P
- IEC/PAS-62396-6 - Process management for avionics - Atmospheric radiation effects - Part 6: Extreme space weather and potential impact on the avionics environment and electronics
- IEC/PAS-62435 - Electronic components - Long-duration storage of electronic components - Guidance for implementation
- IEC/PAS-62500 - Process Management for Avionics - Guide for Defining & Performing Highly Accelerated T
- IEC/PAS-62647-1 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
- IEC/PAS-62647-2 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin
- IEC/PAS-62647-21 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics
- IEC/PAS-62647-22 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
- IEC/PAS-62647-23 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
- IEC/PAS-62647-3 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
- IEC/PAS-62686-1 - Part 1: General Requirements for High Reliability Integrated Circuits & Discrete Semic
- IEC/PAS-62686-2 - Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 2: General requirements for passive components
ISO:
- ISO-17901-1 - Optics and photonics - Holography - Part 1: Methods of measuring diffraction efficiency and associated optical characteristics of holograms
- ISO-17901-2 - Optics and photonics - Holography - Part 2: Methods for measurement of hologram recording characteristics
Other SDOs:
- DS-EN-50581 - Technical documentation for the assessment of electrical and electronic products with respect to the restriction of hazardous substances
- EN-50419 - Marking of Electrical & Electronic Equipment in Accordance With Article 11(2) of Direc
- EN-50581 - Technical documentation for the assessment of electrical and electronic products with respect to the restriction of hazardous substances
- EN-60062 - Marking codes for resistors and capacitors
- EN-60068-2-54 - Environmental Testing, Tests, Test Ta: Solderability Testing of Electronic Components
- EN-60204-1 - Safety of Machinery, Electrical Equipment of Machines, General Requirements
- EN-60286-1 - Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes
- EN-60286-2 - Packaging of components for automatic handling - Part 2: Packaging of components with unidirectional leads on continuous tapes
- EN-60286-3 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
- EN-60286-3-1 - Part 3-1: Packaging of Surface Mount Components on Continuos Tapes - Type V - Pressed
- EN-60286-3-2 - Part 3-2: Packaging of Surface Mount Components on Continuous Tapes - Type VI - Bliste
- EN-60286-4 - Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
- EN-60286-5 - Packaging of Components for Automatic Handling, Matrix Trays
- EN-60294 - Measurement of the dimensions of a cylindrical component with axial terminations
- EN-61360-1 - Standard Data Elements Types With Associated Classification Scheme for Electric Items
- EN-61360-2 - Standard data element types with associated classification scheme for electric components - Part 2: EXPRESS dictionary schema
- EN-61360-4 - Standard Data Element Types With Associated Classification Scheme for Electric Compone
- EN-61360-6 - Standard data element types with associated classification scheme for electric components - Part 6: IEC Common Data Dictionary (IEC CDD) quality guidelines
- EN-61709 - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
- EN-61760-1 - Surface Mounting Technology, Standard Method for the Specification of Surface Mounting
- EN-61760-2 - Part 2: Transportation & Storage Conditions of Surface Mounting Devices (Smd) - Applic
- EN-62321 - Electrotechnical Products, Determination of Levels of Six Regulated Substances (Lead,
- EN-62321-3-1 - Determination of certain substances in electrotechnical products - Part 3-1: Screening - Lead, mercury, cadmium, total chromium and total bromine by X-ray fluorescence spectrometry
- EN-62321-5 - Determination of certain substances in electrotechnical products - Part 5: Cadmium, lead and chromium in polymers and electronics and cadmium and lead in metals by AAS, AFS, ICP-OES and ICP-MS
- EN-62321-7-2 - Determination of certain substances in electrotechnical products - Part 7-2: Hexavalent chromium - Determination of hexavalent chromium (Cr(VI)) in polymers and electronics by the colorimetric method
- EN-62321-8 - Determination of certain substances in electrotechnical products - Part 8: Phthalates in polymers by gas chromatography-mass spectrometry (GC-MS), gas chromatography-mass spectrometry using a pyrolyzer/thermal desorption accessory (Py/TD-GC-MS)
- EN-62430 - Environmentally Conscious Design for Electrical & Electronic Products
- EN-62435-1 - Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
- EN-62435-2 - Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
- EN-62435-5 - Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
- EN-62474 - Material declaration for products of and for the electrotechnical industry
- EN-63002 - Identification and communication interoperability method for external power supplies used with portable computing devices
- EN-IEC-60286-3 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2019)
- EN-IEC-60286-5 - Packaging of components for automatic handling - Part 5: Matrix trays
- JIS-C-0066 - Flammability of solid non-metallic materials when exposed to flame sources -- List of test methods
- SIS-EN-50581 - Technical documentation for the assessment of electrical and electronic products with respect to the restriction of hazardous substances - Swedish Standard - English Language Edition
- SS-EN-45556 - General method for assessing the proportion of reused components in energy-related products
- SS-EN-50419 - Marking of electrical and electronic equipment in accordance with Article 11(2) of Directive 2002/96/EC (WEEE)