IEC-60286-3 › Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

IEC-60286-3 - EDITION 7.0 - CURRENT
Show Complete Document History

Document Center Inc. is an authorized dealer of IEC standards.
The following bibliographic material is provided to assist you with your purchasing decision:


IEC 60286-3:2022 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition:
  1. addition terms and definitions.
  2. addition of a table of the classification to symbols concerning drive hole diameter and distance between the reel hole centre and the drive hole centre;
  3. addition of drive hole to the reel (optional);
  4. revision of reel hole diameter tolerances;
  5. revision of 72 mm tape size carrier tape width dimension tolerances;
  6. addition of Annex B (informative);
  7. addition of component size 0201M.
ORDER

Price:

$374.42        


Want this as a site license?

To find similar documents by classification:

31.020 (Electronic components in general Magnetic components, see 29.100.10)

31.240 (Mechanical structures for electronic equipment)

This document comes with our free Notification Service, good for the life of the document.

This document is available in either Paper or PDF format.

 

Customers who bought this document also bought:

UL-94
Standard for Tests for Flammability of Plastic Materials for Parts in Devices and Appliances

IPC/EIA-J-STD-002
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

MIL-STD-883
Microcircuits

Document Number

IEC 60286-3 Ed. 7.0 b:2022

Revision Level

EDITION 7.0

Status

Current

Publication Date

Dec. 1, 2022

Committee Number

40