IEC-60286-7 › Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components
IEC-60286-7
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EDITION 1.0
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CURRENT
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IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.
To find similar documents by classification:
31.020 (Electronic components in general Magnetic components, see 29.100.10)
31.240 (Mechanical structures for electronic equipment)
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Document Number
IEC/TR 60286-7 Ed. 1.0 b:2019
Revision Level
EDITION 1.0
Status
Current
Publication Date
Oct. 1, 2019
Committee Number
40