IEC-62647-2 › Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin

IEC-62647-2 - EDITION 1.0 - CURRENT


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IEC/TS 62647-2:2012(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes. It may be used by other high-performance and high-reliability industries, at their discretion.
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03.100.50 (Production. Production management)

31.020 (Electronic components in general Magnetic components, see 29.100.10)

49.060 (Aerospace electric equipment and systems Including Avionics)

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Document Number

IEC/TS 62647-2 Ed. 1.0 en:2012

Revision Level

EDITION 1.0

Status

Current

Publication Date

Nov. 29, 2012

Committee Number

107