ASTM-F677 › Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications (Withdrawn 2013)
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Scope
1.1 This test method determines the resistance of encapsulating compounds to fluids or greases by measuring changes in weight (Note 1) and volume under defined conditions of time and temperature.
1.2 The values stated in SI units are standard. The values in parentheses are for information only.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. See 9.1.
Significance and Use
5.1 Fluids and greases in contact with encapsulating compounds have the potential to adversely modify the encapsulant properties with resulting damage or loss of protection to components in electronic applications.
5.2 This test method provides a means for measuring the effect of fluids and greases on various encapsulants.
Keywords
electronic; encapsulating compound; grease; microelectronics; ICS Number Code 31.020 (Electronic components in general)
To find similar documents by ASTM Volume:
10.02 (Electrical Insulation (II): D2518 - latest)
To find similar documents by classification:
31.020 (Electronic components in general Magnetic components, see 29.100.10)
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Document Number
ASTM-F677-13
Revision Level
2013 EDITION
Status
Cancelled
Modification Type
Withdrawn
Publication Date
April 15, 2013
Document Type
Test Method
Page Count
3 pages
Committee Number
D09.01