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Defines the composition, property requirements and tolerances on dimensions and form for copper and copper alloy strip for lead frame material, not exceeding widths of 100 mm. Thickness between 0.1 mm and 1.0 mm are mainly used for stamped lead frames for integrated circuits and low power devices, and thicknesses between 1.0 mm and 2.0 mm are mainly for stamped lead frames for high power devices. Also defines sampling methods, test procedures for verifying conformity to standard requirements, and delivery conditions.