NAS-4123 › Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (Dip)

NAS-4123 - REVISION 2 - CURRENT
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Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (Dip)


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Document Number

NAS-4123

Revision Level

REVISION 2

Status

Current

Publication Date

Jan. 31, 2024

Page Count

16 pages