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Scope

Part 1 of this test method standard establishes uniform test methods for the basic environmental testing of semiconductor devices to determine resistance to deleterious effects of natural elements and conditions surrounding military operations. For the purpose of this test method standard, the term "devices" includes such items as transistors, diodes, voltage regulators, rectifiers, tunnel diodes, and other related parts. This part of a multipart test method standard is intended to apply only to semiconductor devices.

Notes

Claudia's Notes:
This Part 1 contains Test Methods 1001 through 1081 inclusive.  The intended use of this test method standard is to establish appropriate conditions for testing semiconductor devices to give test results that simulate the actual service conditions existing in the field. This test method standard has been prepared to provide uniform test methods, controls, and procedures for determining with predictability the suitability of such devices within military, aerospace and special application equipment.

Here's the summary of Change 1 modifications:

1. Test method 1071, paragraph 13, test condition L1 or L2 – optical gross leak and combined fine/gross leak, was revised to replace the requirement to use correlation data for substantiating test conditions with a requirement limiting the condition to packages with a lid stiffness of .005 μm/PSI (minimum).

2. Test method 1071, paragraph 13.1.1, was revised to add requirements for apparatus initial set up.

3. Test method 1071, paragraph 13.1.2, was revised to add requirements for process monitoring.

4. Test method 1071, paragraph 13.2.1, was revised to add a note regarding structural limits of packages being tested.

To find similar documents by Federal Supply Class Code:

FSC 5961 (Semiconductor Devices and Associated Hardware)

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