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Scope

Part 2 of this test method standard establishes uniform test methods for the mechanical testing to determine resistance to deleterious effects of natural elements and conditions surrounding military operations. For the purpose of this standard, the term "devices" includes such items as transistors, diodes, voltage regulators, rectifiers, tunnel diodes, and other related parts. This part of a multipart test method standard is intended to apply only to semiconductor devices.

Notes

Claudia's Notes:
The current edition includes Changes 1 and 2 in the body of the text.  

Change 1 made the following 2 changes:
1. Test method 2101, paragraph 5.1.e, decap analysis of axial lead or surface mount construction, was corrected to replace digital radiography as a substitutable method for validating die attach integrity with thermal impedance.
2. Test method 2101, paragraph 5.2.1, NOTE, was corrected to replace digital radiography as the method to be used for establishing acceptability for use with thermal transient response testing. A specific addition for accepting transient voltage suppressors using voltage clamping testing has also been added.

Change 2 updated Test method 2038, "Surface Mount End Cap Bond Integrity." The purpose of this method is to simulate the stresses imposed on surface mount devices during installation, removal, and rework.

To find similar documents by Federal Supply Class Code:

FSC 5961 (Semiconductor Devices and Associated Hardware)

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