MIL-S-13949/22 › Sheet, Printed Wiring Board, Laminated, Base Material Bf (Nonwoven Aramid Reinforcement, Epoxy Resin, Metal Clad or Unclad) (No Superseding Document)
Sheet, Printed Wiring Board, Laminated, Base Material Bf (Nonwoven Aramid Reinforcement, Epoxy Resin, Metal Clad or Unclad) (No Superseding Document)
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MIL-S-13949
Sheet, Printed Wiring Board, General Specification for (No Superseding Document)
Document Number
MIL-S-13949/22
Revision Level
REV B CANCELLATION 2
Status
Cancelled
Publication Date
Nov. 30, 1998
Page Count
1 page