MIL-PRF-31032/2 › Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
To find similar documents by Federal Supply Class Code:
FSC 5998 (Electrical and Electronic assemblies, Boards, Cards, and Associated Hardware)
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MIL-PRF-31032/1
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
IPC/EIA-J-STD-001
Requirements for Soldered Electrical and Electronic Assemblies
Document Number
MIL-PRF-31032/2D(1)
Revision Level
REVISION D/AM 1
Status
Superseded
Publication Date
July 22, 2022
Page Count
27 pages