MIL-PRF-31032/1 › Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

MIL-PRF-31032/1 - REVISION D/AM 4 - SUPERSEDED
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Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting


To find similar documents by Federal Supply Class Code:

FSC 5998 (Electrical and Electronic assemblies, Boards, Cards, and Associated Hardware)

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Document Number

MIL-PRF-31032/1D(4)

Revision Level

REVISION D/AM 4

Status

Superseded

Publication Date

July 21, 2022

Page Count

39 pages