MIL-HDBK-419/2 › Grounding, Bonding, and Shielding for Electronic Equipments and Facilities, Applications, Volume II: Applications

MIL-HDBK-419/2 - REVISION A - CURRENT -- See the following: MIL-HDBK-419/1
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Included in this current edition are the following subparts:

 REVISION A - Dec. 29, 1987
 REV A VALIDATION 1 - Feb. 20, 2014


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Document Number

MIL-HDBK-419/2

Revision Level

REVISION A

Status

Current

Publication Date

Dec. 29, 1987

Page Count

400 pages