IEC-63357 Semiconductor devices - Standardization roadmap of fault test method for automotive vehicles

IEC-63357 - EDITION 1.0 - CURRENT


Document Center Inc. is an authorized dealer of IEC standards.
The following bibliographic material is provided to assist you with your purchasing decision:


IEC TR 63357:2022(E) describes standardization roadmap of fault test methods for integrated circuits used in automotive vehicles. Since automotive vehicles are exposed in harsh environment such as very low or high temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment. There are several fault test methods and related issues to be standardized.
Semiconductor devices used in automotive vehicles are exposed in harsh environment of very high or very low temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment Evaluation results following this fault test methods will provide robustness of the semiconductor device.
ORDER

Price:

$99.91        


Want this as a site license?

To find similar documents by classification:

31.080.99 (Other semiconductor devices)

This document comes with our free Notification Service, good for the life of the document.

This document is available in either Paper or PDF format.

Document Number

IEC/TR 63357 Ed. 1.0 en:2022

Revision Level

EDITION 1.0

Status

Current

Publication Date

Oct. 1, 2022

Committee Number

47