IEC-62047-43 Semiconductor devices - Micro-electromechanical devices - Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices

IEC-62047-43 - EDITION 1.0 - CURRENT


Document Center Inc. is an authorized dealer of IEC standards.
The following bibliographic material is provided to assist you with your purchasing decision:


IEC 62047-43:2024 specifies the test method of electrical characteristics after cyclic bending deformation for flexible electromechanical devices. These devices include passive micro components and active micro components on the flexible film or embedded in the flexible film. The desired in-plane dimensions of the device for the test method ranges typically from 1 mm to 300 mm and the thickness ranges from 10 m to 1 mm, but these are not limiting values. The test method is so designed as to understand and further visualize the entire performance deterioration behaviour after cyclic bending deformation in a concept of 3D (P-S-N: Performance - Severity of bending - Number of cycles) plot over the loading space of severity of bending and number of repeated cycles. This document is essential to estimate safety margin over the operation period under a certain level of cyclic bending deformation and indispensable for reliable design of the product employing these devices.
ORDER

Price:

$143.56        


Want this as a site license?

To find similar documents by classification:

31.080.99 (Other semiconductor devices)

This document comes with our free Notification Service, good for the life of the document.

This document is available in either Paper or PDF format.

Document Number

IEC 62047-43 Ed. 1.0 en:2024

Revision Level

EDITION 1.0

Status

Current

Publication Date

March 1, 2024

Committee Number

47F