IEC-62047-25 › Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

IEC-62047-25 - EDITION 1.0 - CURRENT


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IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.
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Document Number

IEC 62047-25 Ed. 1.0 b:2016

Revision Level

EDITION 1.0

Status

Current

Publication Date

Aug. 1, 2016

Committee Number

47F