IEC-62047-16 › Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

IEC-62047-16 - EDITION 1.0 - CURRENT


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IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.
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Document Number

IEC 62047-16 Ed. 1.0 b:2015

Revision Level

EDITION 1.0

Status

Current

Publication Date

March 5, 2015

Committee Number

47F