IEC-62047-10 › Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
IEC-62047-10
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EDITION 1.0
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CURRENT
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Included in this current edition are the following subparts:
EDITION 1.0 - July 1, 2011
ED. 1.0 CORRIGENDUM 1 - Feb. 1, 2012
ED. 1.0 CORRIGENDUM 1 - Feb. 1, 2012
IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials.
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31.080.99 (Other semiconductor devices)
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Document Number
IEC 62047-10 Ed. 1.0 b:2011
Revision Level
EDITION 1.0
Status
Current
Publication Date
July 1, 2011
Committee Number
47F