IEC-61837-2 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures

IEC-61837-2 - EDITION 3.0 - CURRENT
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Included in this current edition are the following subparts:

 EDITION 3.0 - May 1, 2018
 EDITION 3.1 - Sept. 1, 2020

IEC 61837-2:2018(E) deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016. This edition includes the following significant technical changes with respect to the previous edition:
a. revision of the figures to match the notation of the drawings of IEC 61240:2016;
b. addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C.
As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.
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Document Number

IEC 61837-2 Ed. 3.0 en:2018

Revision Level

EDITION 3.0

Status

Current

Publication Date

May 1, 2018

Committee Number

49