IEC-60747-17 › Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
IEC-60747-17
-
EDITION 1.0
-
CURRENT
Document Center Inc. is an authorized dealer of IEC standards.
The following bibliographic material is provided to assist you with your purchasing decision:
The following bibliographic material is provided to assist you with your purchasing decision:
Included in this current edition are the following subparts:
EDITION 1.0 - Sept. 1, 2020
ED. 1.0 CORRIGENDUM 1 - Jan. 1, 2021
ED. 1.0 CORRIGENDUM 1 - Jan. 1, 2021
IEC 60747-17:2020(E) specifies the terminology, essential ratings, characteristics, safety test and the measuring methods of magnetic coupler and capacitive coupler.
It specifies the principles and requirements of insulation and isolation characteristics for magnetic and capacitive couplers for basic insulation and reinforced insulation.
This first edition cancels and replaces IEC PAS 60747-17:2011. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to IEC PAS 60747-17:2011:
a) introduced lifetime safety factors for improved life time consideration, to comply with widely recognized aging mechanisms of silicone dioxide (TDDB) and thin film polymer isolation layers;
b) significantly improved "end of life testing" paragraph and statistical life time consideration by adding detailed description on process, safety factors, methods of generating data points and respective lifetime interpolations as well as being specific on minimum amount of samples required;
c) introduced concept of certification by similarity, including Annex A, giving guidance on qualification considerations and required certification process;
d) alternative pulse shape allowed for surge pulse testing, to avoid issues due to surge tester availability;
e) various improvements throughout the standard: definitions, for example type of coupler have been improved, introduction of surge impulse VIMP rating, usage of glass transition temperature, pre-conditioning have been redefined for improved usability and better compatibility with today.s design and functionality of couplers, available mold compounds, etc.
To find similar documents by classification:
31.080.99 (Other semiconductor devices)
This document comes with our free Notification Service, good for the life of the document.
This document is available in either Paper or PDF format.
Customers who bought this document also bought:
IPC/EIA-J-STD-001Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610
Acceptability of Electronic Assemblies (Hardcopy format)
ISO-9001
Quality management systems - Requirements
Document Number
IEC 60747-17 Ed. 1.0 en:2020
Revision Level
EDITION 1.0
Status
Current
Publication Date
Sept. 1, 2020
Committee Number
47E