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Included in this current edition are the following subparts:

Scope

1 Scope

1.1 These requirements apply to rigid printed-wiring boards and flexible printed-wiring board for use as components in devices or appliances. Compliance with these requirements does not indicate that the product is acceptable for use as a component of an end product without further investigation.

1.2 The flexible printed-wiring boards covered by these requirements consist of conductors affixed to insulating base film, with or without a cover-lay film, with midboard connections.

1.3 These requirements do not cover flexible printed-wiring boards of laminated-film construction in which the conductors are parallel to each other and are completely covered by the base film with only point-to-point end connections.

1.4 These requirements do not apply to flexible, flex-to-install, rigid, and multilayer rigid flex composite interconnect constructions with and without stiffener and adhesive materials as flexible materials interconnect constructions (FMIC's) for use as components in devices or appliances - that are covered by the Standard for Flexible Materials Interconnect Constructions, UL 796F.

Notes

Claudia's Notes:
This revision of ANSI/UL 796 includes the removal of Requirements for Thin Core Substrates from Table 20.9.

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