SS-EN-ISO-9455-14 › Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017)
SS-EN-ISO-9455-14
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2018 EDITION
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CURRENT
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ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.
To find similar documents by classification:
25.160.50 (Brazing and soldering Including brazing and soldering alloys and equipment)
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Designation Name
SS-EN ISO 9455-14:2018
Revision Level
2018 EDITION
Status
Current
Publication Date
Jan. 8, 2018
Language(s)
English
Page Count
20
International Equivalent
EN ISO 9455-14:2017(IDT); ISO 9455-14:2017(IDT)