SS-EN-ISO-9453 › Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)
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This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included.
To find similar documents by classification:
25.160.50 (Brazing and soldering Including brazing and soldering alloys and equipment)
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Designation Name
SS-EN ISO 9453:2020
Revision Level
2020 EDITION
Status
Current
Publication Date
Oct. 14, 2020
Language(s)
English
Page Count
24
International Equivalent
EN ISO 9453:2020(IDT); ISO 9453:2020(IDT)