MIL-S-13949/31 › Sheet, Printed Wiring Board, Laminated, Base Material Bi (Nonwoven Aramid Reinforcement, Polyimide Resin, Metal Clad or Unclad) (No Superseding Document)
Sheet, Printed Wiring Board, Laminated, Base Material Bi (Nonwoven Aramid Reinforcement, Polyimide Resin, Metal Clad or Unclad) (No Superseding Document)
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FSC 5998 (Electrical and Electronic assemblies, Boards, Cards, and Associated Hardware)
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Document Number
MIL-S-13949/31
Revision Level
GROUP CANCELLATION 2
Status
Cancelled
Publication Date
Nov. 30, 1998
Page Count
1 page