MIL-S-13949/19 › Sheet, Printed Wiring Board, Laminated, Base Material Qi (Woven Quartz Reinforcement, Polyimide Resin, Heat Resistant, Metal Clad or Unclad) (No Superseding Document)
Sheet, Printed Wiring Board, Laminated, Base Material Qi (Woven Quartz Reinforcement, Polyimide Resin, Heat Resistant, Metal Clad or Unclad) (No Superseding Document)
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Document Number
MIL-S-13949/19
Revision Level
REV A CANCELLATION 2
Status
Cancelled
Publication Date
Nov. 30, 1998
Page Count
1 page