MIL-PRF-31032/5 › Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
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Document Number
MIL-PRF-31032/5C(3)
Revision Level
REVISION C/AM 3
Status
Current
Publication Date
May 5, 2024
Page Count
56 pages