MIL-P-46872 › Potting and Molding of Cable Assemblies, Process For
Included in this current edition are the following subparts:
REVISION A - July 16, 1990
REV A INACTIVATION 1 - May 20, 1996
REV A VALIDATION 2 - April 25, 2018
REV A INACTIVATION 1 - May 20, 1996
REV A VALIDATION 2 - April 25, 2018
To find similar documents by Federal Supply Class Code:
FSC 14GP (Guided Missiles -- General)
This document comes with our free Notification Service, good for the life of the document.
This document is available in either Paper or PDF format.
Customers who bought this document also bought:
ASTM-D3013Standard Specification for Epoxy Molding Compounds
IPC/EIA-J-STD-001
Requirements for Soldered Electrical and Electronic Assemblies
ISO-9000 COMPENDIUM
ISO 9000 - Quality Management (12th Edition Compendium)
Document Number
MIL-P-46872
Revision Level
REVISION A
Status
Current
Publication Date
July 16, 1990
Page Count
13 pages