ISO-9455-18 › Soft soldering fluxes - Test methods - Part 18: Cleanliness of soldered printed circuit assemblies before and/or after cleaning

ISO-9455-18 - 1ST EDITION - CURRENT


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This document specifies test methods for the cleanliness of soldered printed circuit assemblies before and/or after soldering and cleaning. The test is applicable to all fluxes as defined in ISO 9454-1.

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Document Number

ISO 9455-18:2024

Revision Level

1ST EDITION

Status

Current

Publication Date

Aug. 1, 2024

Committee Number

ISO/TC 44/SC 12