ISO-9455-14 › Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues

ISO-9455-14 - 2ND EDITION - CURRENT
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ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

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25.160.50 (Brazing and soldering Including brazing and soldering alloys and equipment)

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Document Number

ISO 9455-14:2017

Revision Level

2ND EDITION

Status

Current

Publication Date

Aug. 1, 2017

Committee Number

ISO/TC 44/SC 12