ISO-9453 › Soft solder alloys - Chemical compositions and forms

ISO-9453 - 4TH EDITION - CURRENT
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This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

An indication of the forms generally available is also included.

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25.160.50 (Brazing and soldering Including brazing and soldering alloys and equipment)

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Document Number

ISO 9453:2020

Revision Level

4TH EDITION

Status

Current

Publication Date

Sept. 1, 2020

Committee Number

ISO/TC 44/SC 12