IPC/EIA-J-STD-006 › Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

IPC/EIA-J-STD-006 - REVISION C - CURRENT
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Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

Abstract

This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for "special'' electronic grade solders. This is a quality control standard and is not intended to relate directly to the material's performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.

Notes

Claudia's Notes:
If you're doing soldering in the electronics industry, you'll also want to review IPC/EIA-J-STD-005, Requirements for Soldering Fluxes, and IPC/EIA-J-STD-006, Requirements for Soldering Pastes.

If there's issues with marking for lead-free materials and assemblies, see IPC/JEDEC-J-STD-609, Lead- Free and Leaded Marking, Symbols and Labels.


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Document Number

J-STD-006C

Revision Level

REVISION C

Status

Current

Publication Date

July 1, 2013

Page Count

22 pages