IEC-63378-1 › Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

IEC-63378-1 - EDITION 1.0 - CURRENT


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IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.
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Document Number

IEC/TR 63378-1 Ed. 1.0 en:2021

Revision Level

EDITION 1.0

Status

Current

Publication Date

Dec. 1, 2021

Committee Number

47D