IEC-63055 › Format for LSI-Package-Board Interoperable design

IEC-63055 - EDITION 2.0 - CURRENT
Show Complete Document History

Document Center Inc. is an authorized dealer of IEC standards.
The following bibliographic material is provided to assist you with your purchasing decision:


IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.
ORDER

Price:

$512.00        


Want this as a site license?

To find similar documents by classification:

31.180 (Printed circuits and boards)

31.200 (Integrated circuits. Microelectronics Including electronic chips, logical and analogue microstructures Microprocessors, see 35.160)

35.060 (Languages used in information technology)

This document comes with our free Notification Service, good for the life of the document.

This document is available in either Paper or PDF format.

Document Number

IEC 63055 Ed. 2.0 en:2023

Revision Level

EDITION 2.0

Status

Current

Publication Date

Oct. 1, 2023

Committee Number

91