IEC-63011-3 › Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via

IEC-63011-3 - EDITION 1.0 - CURRENT


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IEC 63011-3:2018 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC.
Power devices, RF devices and micro-electromechanical systems (MEMS) are not in the scope of this document.
 
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31.200 (Integrated circuits. Microelectronics Including electronic chips, logical and analogue microstructures Microprocessors, see 35.160)

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Document Number

IEC 63011-3 Ed. 1.0 b:2018

Revision Level

EDITION 1.0

Status

Current

Publication Date

Nov. 28, 2018

Committee Number

47A