IEC-63011-2 › Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

IEC-63011-2 - EDITION 1.0 - CURRENT


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IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.

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31.200 (Integrated circuits. Microelectronics Including electronic chips, logical and analogue microstructures Microprocessors, see 35.160)

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Document Number

IEC 63011-2 Ed. 1.0 b:2018

Revision Level

EDITION 1.0

Status

Current

Publication Date

Nov. 28, 2018

Committee Number

47A