IEC-62899-202-9 › Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test

IEC-62899-202-9 - EDITION 1.0 - CURRENT


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IEC 62899-202-9:2023 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.
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31.180 (Printed circuits and boards)

87.080 (Inks. Printing inks Materials for graphic technology, see 37.100.20)

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Document Number

IEC 62899-202-9 Ed. 1.0 en:2023

Revision Level

EDITION 1.0

Status

Current

Publication Date

Aug. 1, 2023

Committee Number

119