IEC-62878-2-1 › Device embedded substrate - Part 2-1: Guidelines - General description of technology
IEC-62878-2-1
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EDITION 1.0
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CURRENT
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IEC TS 62878-2-1:2015 describes the basics of device embedding substrate. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
To find similar documents by classification:
31.180 (Printed circuits and boards)
31.190 (Electronic component assemblies Including preassembled modules)
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Document Number
IEC/TS 62878-2-1 Ed. 1.0 b:2015
Revision Level
EDITION 1.0
Status
Current
Publication Date
March 30, 2015
Committee Number
91