IEC-62878-1 › Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

IEC-62878-1 - EDITION 1.0 - CURRENT


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IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
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31.180 (Printed circuits and boards)

31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

IEC 62878-1 Ed. 1.0 en:2019

Revision Level

EDITION 1.0

Status

Current

Publication Date

Oct. 1, 2019

Committee Number

91