IEC-61249-2-51 › Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
IEC-61249-2-51
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EDITION 1.0
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CURRENT
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IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
To find similar documents by classification:
31.180 (Printed circuits and boards)
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Document Number
IEC 61249-2-51 Ed. 1.0 b:2023
Revision Level
EDITION 1.0
Status
Current
Publication Date
May 1, 2023
Committee Number
91