IEC-61191-7 › Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
IEC-61191-7
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EDITION 1.0
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CURRENT
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IEC TR 61191-7:2020(E) serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.
To find similar documents by classification:
31.180 (Printed circuits and boards)
31.190 (Electronic component assemblies Including preassembled modules)
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Document Number
IEC/TR 61191-7 Ed. 1.0 en:2020
Revision Level
EDITION 1.0
Status
Current
Publication Date
March 1, 2020
Committee Number
91