IEC-61189-5-501 › Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
IEC-61189-5-501
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1ST EDITION
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CURRENT
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IEC 61189-5-501:2021 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture.
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31.180 (Printed circuits and boards)
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Document Number
IEC 61189-5-501 Ed. 1.0 b:2021
Revision Level
1ST EDITION
Status
Current
Publication Date
Jan. 1, 2021
Committee Number
91