IEC-61189-5 › Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
IEC-61189-5
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1ST EDITION
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CURRENT
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IEC 61189-5:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
To find similar documents by classification:
31.180 (Printed circuits and boards)
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Document Number
IEC 61189-5 Ed. 1.0 b:2006
Revision Level
1ST EDITION
Status
Current
Publication Date
Aug. 1, 2006
Committee Number
91