IEC-61189-2-808 › Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

IEC-61189-2-808 - EDITION 1.0 - CURRENT


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IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
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Document Number

IEC 61189-2-808 Ed. 1.0 b:2024

Revision Level

EDITION 1.0

Status

Current

Publication Date

April 1, 2024

Committee Number

91