IEC-61189-2-807 › Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

IEC-61189-2-807 - EDITION 1.0 - CURRENT


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IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).
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31.180 (Printed circuits and boards)

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Document Number

IEC 61189-2-807 Ed. 1.0 b:2021

Revision Level

EDITION 1.0

Status

Current

Publication Date

Sept. 1, 2021

Committee Number

91