IEC-61189-2-804 › Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
IEC-61189-2-804
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EDITION 1.0
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CURRENT
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IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.
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31.180 (Printed circuits and boards)
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Document Number
IEC 61189-2-804 Ed. 1.0 b:2023
Revision Level
EDITION 1.0
Status
Current
Publication Date
Aug. 1, 2023
Committee Number
91