IEC-61189-2-721 › Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator
IEC-61189-2-721
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EDITION 1.0
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CURRENT
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IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR). IEC 61189-2-721:2015 is applicable to copper clad laminates and dielectric base materials.
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31.180 (Printed circuits and boards)
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Document Number
IEC 61189-2-721 Ed. 1.0 b:2015
Revision Level
EDITION 1.0
Status
Current
Publication Date
April 29, 2015
Committee Number
91